Modern technologies of soldering, providing increased strength and ductility of metal joints
Sometimes, the operations of electronic devices have failures due to lack of strength and ductility of the metal solder joints. As known, a main condition for ensuring of the required strength and ductility of the metal compounds is the choice of optimal brazing temperature. As the result of theo...
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Інститут металофізики ім. Г.В. Курдюмова НАН України
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irk-123456789-1042712016-07-07T03:02:14Z Modern technologies of soldering, providing increased strength and ductility of metal joints Shtennikov, V.N. Budai, B.T. Физика прочности и пластичности Sometimes, the operations of electronic devices have failures due to lack of strength and ductility of the metal solder joints. As known, a main condition for ensuring of the required strength and ductility of the metal compounds is the choice of optimal brazing temperature. As the result of theoretical and experimental studies, the dependences connecting the surface temperature of joint metals and alloys with the parameters of the wave, laser, convection soldering are obtained. The use of the mentioned relationships increases the efficiency of fabrication of strength and ductile solder joints. При експлуатації електронних приладів іноді виникають відмови через недостатню міцність і пластичність паяних металевих з’єднань. Відомо, що основною умовою забезпечення необхідної міцности та пластичности металевих з’єднань є вибір оптимальної температури пайки. В результаті теоретичних і експериментальних досліджень одержано залежності, що зв’язують температуру поверхні металів і стопів, які з’єднуються, з параметрами хвильової, лазерної, конвекційної пайки. Застосування цих залежностей уможливило підвищити ефективність технології випуску міцних і пластичних з’єднань. При эксплуатации электронных приборов иногда возникают отказы из-за недостаточной прочности и пластичности паяных металлических соединений. Известно, что основным условием обеспечения требуемой прочности и пластичности металлических соединений является выбор оптимальной температуры пайки. В результате теоретических и экспериментальных исследований получены зависимости, связывающие температуру поверхности соединяемых металлов и сплавов с параметрами волновой, лазерной, конвекционной пайки. Применение упомянутых зависимостей позволило повысить эффективность технологии выпуска прочных и пластичных паяных соединений. 2013 Article Modern technologies of soldering, providing increased strength and ductility of metal joints / V.N. Shtennikov, B.T. Budai // Металлофизика и новейшие технологии. — 2013. — Т. 35, № 12. — С. 1725-1731. — Бібліогр.: 7 назв. — англ. 1024-1809 PACS numbers: 06.60.Vz, 62.20.fk, 81.20.Vj, 81.40.-z http://dspace.nbuv.gov.ua/handle/123456789/104271 en Металлофизика и новейшие технологии Інститут металофізики ім. Г.В. Курдюмова НАН України |
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Физика прочности и пластичности Физика прочности и пластичности |
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Физика прочности и пластичности Физика прочности и пластичности Shtennikov, V.N. Budai, B.T. Modern technologies of soldering, providing increased strength and ductility of metal joints Металлофизика и новейшие технологии |
| description |
Sometimes, the operations of electronic devices have failures due to lack of
strength and ductility of the metal solder joints. As known, a main condition
for ensuring of the required strength and ductility of the metal compounds is
the choice of optimal brazing temperature. As the result of theoretical and
experimental studies, the dependences connecting the surface temperature of
joint metals and alloys with the parameters of the wave, laser, convection
soldering are obtained. The use of the mentioned relationships increases the
efficiency of fabrication of strength and ductile solder joints. |
| format |
Article |
| author |
Shtennikov, V.N. Budai, B.T. |
| author_facet |
Shtennikov, V.N. Budai, B.T. |
| author_sort |
Shtennikov, V.N. |
| title |
Modern technologies of soldering, providing increased strength and ductility of metal joints |
| title_short |
Modern technologies of soldering, providing increased strength and ductility of metal joints |
| title_full |
Modern technologies of soldering, providing increased strength and ductility of metal joints |
| title_fullStr |
Modern technologies of soldering, providing increased strength and ductility of metal joints |
| title_full_unstemmed |
Modern technologies of soldering, providing increased strength and ductility of metal joints |
| title_sort |
modern technologies of soldering, providing increased strength and ductility of metal joints |
| publisher |
Інститут металофізики ім. Г.В. Курдюмова НАН України |
| publishDate |
2013 |
| topic_facet |
Физика прочности и пластичности |
| url |
http://dspace.nbuv.gov.ua/handle/123456789/104271 |
| citation_txt |
Modern technologies of soldering, providing increased strength and ductility of metal joints / V.N. Shtennikov, B.T. Budai // Металлофизика и новейшие технологии. — 2013. — Т. 35, № 12. — С. 1725-1731. — Бібліогр.: 7 назв. — англ. |
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1725
ФИЗИКА ПРОЧНОСТИ И ПЛАСТИЧНОСТИ
PACS numbers: 06.60.Vz, 62.20.fk, 81.20.Vj, 81.40.-z
Modern Technologies of Soldering, Providing Increased
Strength and Ductility of Metal Joints
V. N. Shtennikov and B. T. Budai
First President of Russia B. N. Yeltsin Ural Federal University,
Mira Street, 19,
620002 Yekaterinburg, Russia
Sometimes, the operations of electronic devices have failures due to lack of
strength and ductility of the metal solder joints. As known, a main condition
for ensuring of the required strength and ductility of the metal compounds is
the choice of optimal brazing temperature. As the result of theoretical and
experimental studies, the dependences connecting the surface temperature of
joint metals and alloys with the parameters of the wave, laser, convection
soldering are obtained. The use of the mentioned relationships increases the
efficiency of fabrication of strength and ductile solder joints.
При експлуатації електронних приладів іноді виникають відмови через
недостатню міцність і пластичність паяних металевих з’єднань. Відомо,
що основною умовою забезпечення необхідної міцности та пластичности
металевих з’єднань є вибір оптимальної температури пайки. В результаті
теоретичних і експериментальних досліджень одержано залежності, що
зв’язують температуру поверхні металів і стопів, які з’єднуються, з пара-
метрами хвильової, лазерної, конвекційної пайки. Застосування цих за-
лежностей уможливило підвищити ефективність технології випуску міц-
них і пластичних з’єднань.
При эксплуатации электронных приборов иногда возникают отказы из-за
недостаточной прочности и пластичности паяных металлических соеди-
нений. Известно, что основным условием обеспечения требуемой прочно-
сти и пластичности металлических соединений является выбор опти-
мальной температуры пайки. В результате теоретических и эксперимен-
тальных исследований получены зависимости, связывающие температу-
ру поверхности соединяемых металлов и сплавов с параметрами волно-
вой, лазерной, конвекционной пайки. Применение упомянутых зависи-
мостей позволило повысить эффективность технологии выпуска прочных
и пластичных паяных соединений.
Key words: metallic solder joints, temperature and time of soldering,
Металлофиз. новейшие технол. / Metallofiz. Noveishie Tekhnol.
2013, т. 35, № 12, сс. 1725—1731
Оттиски доступны непосредственно от издателя
Фотокопирование разрешено только
в соответствии с лицензией
2013 ИМФ (Институт металлофизики
им. Г. В. Курдюмова НАН Украины)
Напечатано в Украине.
1726 V. N. SHTENNIKOV and B. T. BUDAI
strength and ductility of solder joints.
(Received July 10, 2013)
1. INTRODUCTION
Experience in the production of electronic devices shows that their re-
liability is primarily determined by the quality of solder joints [1]. On
the other hand, the characteristics of solder joints made, for example,
using lead-tin eutectic, their strength and ductility, primarily depend
on the brazing temperature [2, 3].
Thus, the solution of the problem to provide the required tempera-
ture of soldering is one of the key issues to improve the quality of sol-
der joints and, therefore, of electronic devices. However, this problem
was not enough discussed emphasis in the literature that determines
its relevance.
2. THE METHODOLOGY OF THE RESEARCH AND RESULTS
The temperature was measured by a chromel—copel or copper—
constantan thermocouple. In this case, the diameter of the thermocou-
ple was much smaller than the diameter of the output electrode of com-
ponent. To record the thermo-EMF, KSP-4 potentiometer with accura-
cy rating 0.25 was used. Temperature measuring accuracy was 1С.
Soldering time was determined by an electronic stopwatch.
The quality of solder joints was evaluated: visually, using MBS-2
microscope, by the methods of the study of shapes and microsections of
solder joints and their mechanical strength (testing of automation sys-
tems devices for the impact of blows).
2.1. Soldering by the Wave of Molten Solder
During wave soldering, the lower surface of the printed-circuit board
(PCB), including the solder joints, is constantly washed by the molten
solder. Therefore, soldering temperature is equal to the temperature of
the molten solder. Soldering time depends on the speed of the board
motion along the conveyor and the width of the wave. Thus, the basic
parameters of soldering (temperature and time) are easily adjustable,
ensuring consistent high quality of solder joints.
Figure 1 shows a multilayer printed-circuit board with the pads lo-
cated on one level, soldered by the double wave of molten solder.
The joints made without abutting of output electrodes to the pads
located on different levels of PCB soldered by the wave, laser or con-
vection soldering have a characteristic shape: if the gap between the
MODERN TECHNOLOGIES OF SOLDERING 1727
output electrode of the component and the contact pad is more than
0.2 mm, the solder connection is not formed and the whole solder re-
mains on the output electrode [4].
Our experimental studies have shown that for the molten solder
wave soldering, unlike the manual soldering using soldering tools, the
following shapes of solder joints and the types of defects are typical:
filled shape of the solder joint with dimensions larger than the contact
pad, through-shell, dry joint, cavities and pores, solder bridges be-
tween adjacent pads.
2.2. Laser Soldering
The results of research on laser brazing showed the possibility of its
application for assembling of electron devices if the PCB contact pads
are located on the one level. This method allows producing the solder
joints in electronic devices with high-density of assembling and fine
pitch of output electrodes without formation of jumpers and solder
balls. During soldering, PCBs and packages of components do not prac-
tically heat up, which allows one to mount chips that are sensitive to
heat. As established, the packages of chips are not subjected to direct
laser exposure, so they are heated during soldering of output elec-
trodes to temperature not higher than 113C. Strength of solder joints
of boards produced by laser soldering automatic machine coated with
hot POS61 is 11 Newtons per output for joints with solder excess and
6.60 Newtons per output for joints of skeletal shape. The average value
of the mechanical peel strength was 8.80 Newtons per output electrode
for single contact pads. The rupture of solder joints propagates along
the output electrode—solder interface.
Knowing the power of radiation and the absorption coefficient of the
Fig. 1. Soldering of the printed-circuit board with contact pads located on one
level by the double wave of molten solder.
1728 V. N. SHTENNIKOV and B. T. BUDAI
surface, one can determine the intensity of the heat flux of radiation
and solve the problem for heating a semi-closed plate, on the surface of
which heat flux is specified [5].
If the intensity of the heat flux at the surface of semi-closed body is
proportional to 1/2, the temperature gradient can be calculated as in
the case of contact soldering according to equation [5]:
( , ) ( 0)
1
2
п x п х
п
x
t t
a
, (1)
where tn(x, ) is soldering temperature, n is the soldering time,
a /(c) is thermal conductivity, is the heat conductivity factor,
is density, c is specific heat,
21/2
0
( ) 2
u
u e d is the probability in-
tegral.
To avoid overheating of heat sensitive components, the temperature
of heating surface should not exceed 265C and at a maximum dis-
tance–at least 230C to ensure good quality of solder joints. Taking
into account the temperature measurement accuracy of soldering tool
(before soldering) and of soldering temperature, the permissible range
of the soldering temperature will not exceed 10C. In accordance with
these restrictions, the maximum permissible value of the relative
change in temperature with depth of solder joint will be
10/265 0.037.
This condition imposes restriction on the time n allowed for solder-
ing of the solder joint with a given thickness x. For example, in the
case of soldering of the copper output electrode of the component and
solder plated hole in circuit board with a thickness of 1.5 mm, mini-
Fig. 2. Microsection of joint made by laser, infrared or convection soldering
on the contact pads located at different levels.
MODERN TECHNOLOGIES OF SOLDERING 1729
mum soldering time is of about 1.4 sec. In the case of soldering of the
Kovar planar output electrode of chip with a thickness of 0.2 mm and
PCB contact pad, the thermal diffusivity of Kovar is approximately 10
times less than that of copper (depth of the solder joint coincides with
the thickness of the output electrode); the minimum soldering time is
of about 0.4 sec. [6].
2.3. Convection Soldering
It is determined that the use of printed circuit boards with contact
pads in one level convection heating is the most promising method,
which provides a significantly smaller temperature variation over the
surface of the printed circuit board than the infrared soldering.
Within the assumption of a constant heat-transfer coefficient be-
tween the surface of the printing unit and the air, at the inhomogenei-
ty of the temperature field in the bulk of printing unit much smaller
than its mean excess temperature, the following formula for heating
temperature of the printed unit was obtained:
0/
max
(1 ).
h
h
t t e
(2)
Solving a similar problem for the cooling mode, one can obtain the
corresponding relationship for the temperature of the cooling printed
unit:
0/
max
.
c
c
t t e
(3)
In Equations (2), (3), quantity tmax is maximum heating temperature
of the printed unit, 0
c and 0
h are constant cooling and heating times of
printed unit, respectively:
0 0
,c h п
п
С
S
(4)
where Sn is the surface area of the printed unit, Cn is heat capacity of
the printed unit, is heat-transfer coefficient.
These relations allow us to estimate reasonably correctly the average
temperature of the printed unit depending on coolant temperature (air
or nitrogen), the surface area of the printed unit, its heat capacity, and
heat-transfer coefficient [7].
In general, the time constants (4) of the heating and cooling of the
printed unit may differ due to different rates of blowing and composi-
tion of heat-transfer medium.
From equations (4), the conclusion is made that a constants of tem-
perature changes in the printed unit at convection heating and cooling
1730 V. N. SHTENNIKOV and B. T. BUDAI
are proportional to their specific heat, and are inversely proportional
to heat-transfer coefficient and their surface area. In particular, the
solder joints, which are in different conditions of blowing by heat-
transfer medium, are heated with different rates. For this reason, the
lower surface of BGA components, where the ball output electrodes are
located, is heated slower than the side surface of components with pla-
nar output electrodes.
Holding at a temperature below the melting temperature of solder,
before finishing heating of the printed unit up to the soldering tem-
perature by changing of the temperature of the heat-transfer medium
and its speed, makes it possible to heat the electronic components more
evenly, regardless of their relative surface area and specific heat.
On the other hand, the components on the circuit board in the iden-
tical housings eliminates mentioned holding without reducing of sol-
dering quality, which is confirmed by our experimental data when im-
plementing technologies of convection soldering of printed circuit
boards with chips having a lead pitch of 0.5 mm.
The quality of solder joints on the tested circuit boards meets the
requirements of the IPC-A-610D international standard ‘Acceptability
of Electronic Assemblies’. Metallographic analysis showed no internal
voids and pores.
Solder joints have a concave fillet, indicating good wetting of both
the material of output electrodes and the contact pads. All joints have
a shiny surface and no shrinkage cavities and pores on the surface.
Modes of surface mounting of chips with the lead pitch of 0.5 mm are
introduced in the batch production of printed circuit boards and are
recommended for use in the manufacture of electronic devices for dif-
ferent purposes on the basis of the surface mounting.
3. CONCLUSIONS
1. The possibility of compliance with required soldering temperature
regimes, and thus the strength and ductility of solder joints for solder
wave soldering, laser soldering, and convection soldering is estimated.
2. It is determined that convection and wave soldering provide reason-
ably precise optimum temperature of soldering, smaller temperature
difference in the depth of solder joints compared with manual contact
or laser soldering.
3. It is determined that heating of the solder joints and temperature
drop by their depth during laser soldering may be estimated by the heat
conduction equations for a half-closed plate with a predetermined heat
flux at the surface. Warming up of the printed unit and, therefore, the
solder joint at convection soldering can be described by equations of
the regular mode.
4. As shown, the time constants of heating and cooling of the printed
MODERN TECHNOLOGIES OF SOLDERING 1731
unit are proportional to the heat capacity and inversely proportional to
the surface area of the printed unit and its heat-transfer coefficient,
which, in turn, depends on the speed of heat-transfer medium and its
composition.
5. High quality solder joints made by traditional and unique technolo-
gies using wave or convection soldering is confirmed by complex test-
ing of automation systems for resistance to the influence of mechani-
cal effects and alternating thermal loads, checking the mechanical
strength of several hundreds of solder joints, visual inspection of the
tens of thousands of solder joints, study of microsections of solder
joints and shapes of solder joints, study of the external view of the
broken solder joints.
6. Convection and wave soldering provide higher quality of solder
joints compared with manual or laser soldering. Furthermore, the cost
of wave and convection soldering is lower than that of manual or laser
soldering. It is reasonable to use the convection and wave soldering.
The results are introduced into batch production of devices for dif-
ferent purposes and have shown high efficiency of production of
strength and ductile metal joints.
REFERENCES
1. V. N. Shtennikov and V. G. Baydakov, Elements and Technology, No. 6: 192
(2004) (in Russian).
2. V. F. Korshak, Y. Shapovalov, P. V. Mateychenko, and I. A. Danilina,
Metallofiz. Noveishie Tekhnol., 30, No. 3: 385 (2008) (in Russian).
3. G. Manco, Soldering and Brazing Alloys (Moscow: Engineering: 1968)
(in Russian).
4. V. N. Shtennikov, Pribory, No. 9: 43 (2008) (in Russian).
5. A. I. Pekhovich and V. M. Zhidkikh, Raschyoty Teplovogo Rezhima Tvyordykh
Tel (Calculations of the Thermal Regime of Solids) (Leningrad: Energiya: 1976)
(in Russian).
6. V. N. Shtennikov, Nano- and Microsystems, No. 2: 18 (2009) (in Russian).
7. V. N. Shtennikov, Sborka v Mashinostroenii i Priborostroenii, No. 4: 23 (2009)
(in Russian).
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/ENU (Use these settings to create Adobe PDF documents best suited for high-quality prepress printing. Created PDF documents can be opened with Acrobat and Adobe Reader 5.0 and later.)
>>
/Namespace [
(Adobe)
(Common)
(1.0)
]
/OtherNamespaces [
<<
/AsReaderSpreads false
/CropImagesToFrames true
/ErrorControl /WarnAndContinue
/FlattenerIgnoreSpreadOverrides false
/IncludeGuidesGrids false
/IncludeNonPrinting false
/IncludeSlug false
/Namespace [
(Adobe)
(InDesign)
(4.0)
]
/OmitPlacedBitmaps false
/OmitPlacedEPS false
/OmitPlacedPDF false
/SimulateOverprint /Legacy
>>
<<
/AddBleedMarks false
/AddColorBars false
/AddCropMarks false
/AddPageInfo false
/AddRegMarks false
/ConvertColors /ConvertToCMYK
/DestinationProfileName ()
/DestinationProfileSelector /DocumentCMYK
/Downsample16BitImages true
/FlattenerPreset <<
/PresetSelector /MediumResolution
>>
/FormElements false
/GenerateStructure false
/IncludeBookmarks false
/IncludeHyperlinks false
/IncludeInteractive false
/IncludeLayers false
/IncludeProfiles false
/MultimediaHandling /UseObjectSettings
/Namespace [
(Adobe)
(CreativeSuite)
(2.0)
]
/PDFXOutputIntentProfileSelector /DocumentCMYK
/PreserveEditing true
/UntaggedCMYKHandling /LeaveUntagged
/UntaggedRGBHandling /UseDocumentProfile
/UseDocumentBleed false
>>
]
>> setdistillerparams
<<
/HWResolution [2400 2400]
/PageSize [612.000 792.000]
>> setpagedevice
|