Modern technologies of soldering, providing increased strength and ductility of metal joints
Sometimes, the operations of electronic devices have failures due to lack of strength and ductility of the metal solder joints. As known, a main condition for ensuring of the required strength and ductility of the metal compounds is the choice of optimal brazing temperature. As the result of theo...
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| Datum: | 2013 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | English |
| Veröffentlicht: |
Інститут металофізики ім. Г.В. Курдюмова НАН України
2013
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| Schriftenreihe: | Металлофизика и новейшие технологии |
| Schlagworte: | |
| Online Zugang: | http://dspace.nbuv.gov.ua/handle/123456789/104271 |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Zitieren: | Modern technologies of soldering, providing increased strength and ductility of metal joints / V.N. Shtennikov, B.T. Budai // Металлофизика и новейшие технологии. — 2013. — Т. 35, № 12. — С. 1725-1731. — Бібліогр.: 7 назв. — англ. |