Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films
By the methods of materials science, the effect of intermediate Cu layer with low surface energy (≅1.83 J/m²) (top, intermediate, and underlayer) in [Fe₅₀Pt₅₀(15 nm)/intermediate Cu(7.5 nm) layer/Fe₅₀Pt₅₀ (15 nm)]n (where n=1,2), top Cu(7.5 nm) layer/Fe₅₀Pt₅₀(15 nm) and Fe₅₀Pt₅₀ (15 nm)/underlayer C...
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Інститут металофізики ім. Г.В. Курдюмова НАН України
2015
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| Zitieren: | Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films / Yu. M. Makogon, O. P. Pavlova, S. I. Sidorenko, T. I. Verbytska, M. Yu. Verbytska, O. V. Fihurna // Металлофизика и новейшие технологии. — 2015. — Т. 37, № 4. — С. 487-498. — Бібліогр.: 18 назв. — англ. |
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irk-123456789-1118832017-01-16T03:03:14Z Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films Makogon, Yu.M. Pavlova, O.P. Sidorenko, S.I. Verbytska, T.I. Verbytska, M.Yu. Fihurna, O.V. Металлические поверхности и плёнки By the methods of materials science, the effect of intermediate Cu layer with low surface energy (≅1.83 J/m²) (top, intermediate, and underlayer) in [Fe₅₀Pt₅₀(15 nm)/intermediate Cu(7.5 nm) layer/Fe₅₀Pt₅₀ (15 nm)]n (where n=1,2), top Cu(7.5 nm) layer/Fe₅₀Pt₅₀(15 nm) and Fe₅₀Pt₅₀ (15 nm)/underlayer Cu(7.5 nm) film compositions on SiO₂(100 nm)/Si(001) substrates on diffusion phase-formation processes and L1₀ phase formation, its structure, and magnetic properties at annealing in vacuum is studied. The film compositions are prepared by magnetron sputtering on thermally oxidized SiO₂ layer by thickness of 100 nm on monocrystalline Si(001) substrate. Subsequent heat treatment is carried out at high vacuum of 1.3∙10⁻³ Pa in the 300—900°C temperature range during 30 s at each temperature. As determined, the chemically disordered A1(FePt) phase is formed in all as-deposited films. The formation of chemically ordered L1₀(FePt) phase in [Fe₅₀Pt₅₀(15 nm)/Сu(7.5 nm) intermediate layer/Fe₅₀Pt₅₀(15 nm)]n films (where n=1,2) with intermediate layers takes place during annealing at 700°C and is accompanied by sharp coercivity increase, which also rises after subsequent high-temperature annealing. In the films with top copper layer, the temperature of L1₀(FePt) phase formation rises up to 900°C. In the films with copper underlayer, the formation of L1₀(FePt) phase is not detected by X-ray analysis, but small coercivity increasing after annealing within the temperature range of 800—900°C can testify that ordering processes proceed. Методами фізичного матеріялознавства вивчено вплив додаткового шару Cu з низькою поверхневою енергією (≅1.83 Дж/м²) (верхнього, проміжного і підшару) в плівкових композиціях [Fe₅₀Pt₅₀(15 нм)/проміжний шар Сu(7,5 нм)/Fe₅₀Pt₅₀(15 нм)]n (де n=1,2), верхній шар Сu(7,5 нм)/Fe₅₀Pt₅₀(15 нм) і Fe₅₀Pt₅₀(15 нм)/підшар Сu(7,5 нм) на підложжях SiO₂(100 нм)/Si(001) на процеси дифузійного фазоутворення, формування фази L1₀ та її структурні й магнетні властивості при відпалах у вакуумі. Плівкові композиції одержано методом магнетронного осадження на термічно окиснене (шар SiO₂товщиною 100 нм) підложжя монокристалічного Si(001). Наступне термічне оброблення тривалістю у 30 секунд виконувалося у високому вакуумі 1,3∙10⁻³ Па в температурному інтервалі 300—900°C. Встановлено, що в усіх плівках після осадження формується хемічно невпорядкована фаза A1(FePt). Формування хемічно впорядкованої фази L1₀(FePt) у плівках з проміжними шарами міді [Fe₅₀Pt₅₀(15 нм)/проміжний шар Сu(7,5 нм)/Fe₅₀Pt₅₀(15 нм)]n (де n=1,2) відбувається в ході відпалу при температурі 700°C і супроводжується різким збільшенням коерцитивної сили, яка зростає також і після наступних високотемпературних відпалів. У плівках з верхнім шаром міді температура формування фази L1₀(FePt) підвищується до 900°C. У плівці з підшаром міді утворення фази L1₀(FePt) рентґенографічно не встановлено, але невелике збільшення коерцитивної сили після відпалів в інтервалі температур 800—900°C може свідчити про перебіг процесів упорядкування. Методами физического материаловедения изучено влияние дополнительного слоя Cu с низкой поверхностной энергией (≅1.83 Дж/м²) (верхнего, промежуточного и подслоя) в плёночных композициях [Fe₅₀Pt₅₀(15 нм)/ промежуточный слой Cu(7,5 нм)/Fe₅₀Pt₅₀(15 нм)]n (где n=1,2), верхний слой Cu(7,5 нм)/Fe₅₀Pt₅₀(15 нм) и Fe₅₀Pt₅₀(15 нм)/подслой Cu(7,5 нм) на подложках SiO₂(100 нм)/Si(001) на процессы диффузионного фазообразования, формирование фазы L1₀ и её структурные и магнитные свойства при отжигах в вакууме. Плёночные композиции получены методом магнетронного осаждения на термически окислённую (слой SiO₂ толщиной 100 нм) подложку монокристаллического Si(001). Последующая термическая обработка длительностью 30 секунд выполнялась в высоком вакууме 1,3∙10⁻³ Па в температурном интервале 300—900°C. Установлено, что во всех плёнках после осаждения формируется химически неупорядоченная фаза A1(FePt). Формирование химически упорядоченной фазы L1₀(FePt) в плёнках с промежуточными слоями меди [Fe₅₀Pt₅₀(15 нм)/промежуточный слой Cu(7,5 нм)/Fe₅₀Pt₅₀(15 нм)]n (где n=1,2) происходит в процессе отжига при температуре 700°C и сопровождается резким увеличением коэрцитивной силы, которая возрастает также и после последующих высокотемпературных отжигов. В плёнках с верхним слоем меди температура формирования фазы L1₀(FePt) повышается до 900°C. В плёнке с подслоем меди образование фазы L1₀(FePt) рентгенографически не установлено, но небольшое увеличение коэрцитивной силы после отжигов в интервале температур 800—900°C может свидетельствовать о прохождении процессов упорядочения. 2015 Article Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films / Yu. M. Makogon, O. P. Pavlova, S. I. Sidorenko, T. I. Verbytska, M. Yu. Verbytska, O. V. Fihurna // Металлофизика и новейшие технологии. — 2015. — Т. 37, № 4. — С. 487-498. — Бібліогр.: 18 назв. — англ. 1024-1809 PACS: 66.30.Pa, 68.55.jd, 75.50.Ss, 75.50.Vv, 75.70.Ak, 81.40.Ef, 81.40.Rs http://dspace.nbuv.gov.ua/handle/123456789/111883 en Металлофизика и новейшие технологии Інститут металофізики ім. Г.В. Курдюмова НАН України |
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Digital Library of Periodicals of National Academy of Sciences of Ukraine |
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| language |
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| topic |
Металлические поверхности и плёнки Металлические поверхности и плёнки |
| spellingShingle |
Металлические поверхности и плёнки Металлические поверхности и плёнки Makogon, Yu.M. Pavlova, O.P. Sidorenko, S.I. Verbytska, T.I. Verbytska, M.Yu. Fihurna, O.V. Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films Металлофизика и новейшие технологии |
| description |
By the methods of materials science, the effect of intermediate Cu layer with low surface energy (≅1.83 J/m²) (top, intermediate, and underlayer) in [Fe₅₀Pt₅₀(15 nm)/intermediate Cu(7.5 nm) layer/Fe₅₀Pt₅₀ (15 nm)]n (where n=1,2), top Cu(7.5 nm) layer/Fe₅₀Pt₅₀(15 nm) and Fe₅₀Pt₅₀ (15 nm)/underlayer Cu(7.5 nm) film compositions on SiO₂(100 nm)/Si(001) substrates on diffusion phase-formation processes and L1₀ phase formation, its structure, and magnetic properties at annealing in vacuum is studied. The film compositions are prepared by magnetron sputtering on thermally oxidized SiO₂ layer by thickness of 100 nm on monocrystalline Si(001) substrate. Subsequent heat treatment is carried out at high vacuum of 1.3∙10⁻³ Pa in the 300—900°C temperature range during 30 s at each temperature. As determined, the chemically disordered A1(FePt) phase is formed in all as-deposited films. The formation of chemically ordered L1₀(FePt) phase in [Fe₅₀Pt₅₀(15 nm)/Сu(7.5 nm) intermediate layer/Fe₅₀Pt₅₀(15 nm)]n films (where n=1,2) with intermediate layers takes place during annealing at 700°C and is accompanied by sharp coercivity increase, which also rises after subsequent high-temperature annealing. In the films with top copper layer, the temperature of L1₀(FePt) phase formation rises up to 900°C. In the films with copper underlayer, the formation of L1₀(FePt) phase is not detected by X-ray analysis, but small coercivity increasing after annealing within the temperature range of 800—900°C can testify that ordering processes proceed. |
| format |
Article |
| author |
Makogon, Yu.M. Pavlova, O.P. Sidorenko, S.I. Verbytska, T.I. Verbytska, M.Yu. Fihurna, O.V. |
| author_facet |
Makogon, Yu.M. Pavlova, O.P. Sidorenko, S.I. Verbytska, T.I. Verbytska, M.Yu. Fihurna, O.V. |
| author_sort |
Makogon, Yu.M. |
| title |
Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films |
| title_short |
Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films |
| title_full |
Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films |
| title_fullStr |
Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films |
| title_full_unstemmed |
Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films |
| title_sort |
influence of copper on а1 to l1₀ phase transformation in nanoscale fe₅₀pt₅₀ films |
| publisher |
Інститут металофізики ім. Г.В. Курдюмова НАН України |
| publishDate |
2015 |
| topic_facet |
Металлические поверхности и плёнки |
| url |
http://dspace.nbuv.gov.ua/handle/123456789/111883 |
| citation_txt |
Influence of Copper on А1 to L1₀ Phase Transformation in Nanoscale Fe₅₀Pt₅₀ Films / Yu. M. Makogon, O. P. Pavlova, S. I. Sidorenko, T. I. Verbytska, M. Yu. Verbytska, O. V. Fihurna // Металлофизика и новейшие технологии. — 2015. — Т. 37, № 4. — С. 487-498. — Бібліогр.: 18 назв. — англ. |
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Металлофизика и новейшие технологии |
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| fulltext |
487
METALLIC SURFACES AND FILMS
PACS numbers:66.30.Pa, 68.55.jd,75.50.Ss,75.50.Vv,75.70.Ak,81.40.Ef, 81.40.Rs
Influence of Copper on А1 to L10 Phase Transformation
in Nanoscale Fe50Pt50 Films
Yu. M. Makogon, O. P. Pavlova, S. I. Sidorenko, T. I. Verbytska,
M. Yu. Verbytska, and O. V. Fihurna
National Technical University of Ukraine ‘KPI’,
Metal Physics Department,
37 Peremogy Avenue,
03056 Kyiv, Ukraine
By the methods of materials science, the effect of intermediate Cu layer with
low surface energy (1.83 J/m2) (top, intermediate, and underlayer) in
[Fe50Pt50(15 nm)/intermediate Cu(7.5 nm) layer/Fe50Pt50 (15 nm)]n (where n
1, 2), top Cu(7.5 nm) layer/Fe50Pt50(15 nm) and Fe50Pt50(15 nm)/underlayer
Cu(7.5 nm) film compositions on SiO2(100 nm)/Si(001) substrates on diffu-
sion phase-formation processes and L10 phase formation, its structure, and
magnetic properties at annealing in vacuum is studied. The film compositions
are prepared by magnetron sputtering on thermally oxidized SiO2 layer by
thickness of 100 nm on monocrystalline Si(001) substrate. Subsequent heat
treatment is carried out at high vacuum of 1.310
3
Pa in the 300—900С tem-
perature range during 30 s at each temperature. As determined, the chemical-
ly disordered A1(FePt) phase is formed in all as-deposited films. The for-
mation of chemically ordered L10(FePt) phase in [Fe50Pt50(15 nm)/Сu(7.5 nm)
intermediate layer/Fe50Pt50(15 nm)]n films (where n 1, 2) with intermediate
layers takes place during annealing at 700С and is accompanied by sharp co-
ercivity increase, which also rises after subsequent high-temperature anneal-
ing. In the films with top copper layer, the temperature of L10(FePt) phase
formation rises up to 900С. In the films with copper underlayer, the for-
mation of L10(FePt) phase is not detected by X-ray analysis, but small coerciv-
ity increasing after annealing within the temperature range of 800—900C can
testify that ordering processes proceed.
Методами фізичного матеріялознавства вивчено вплив додаткового шару
Cu з низькою поверхневою енергією (1,83 Дж/м2) (верхнього, проміжно-
го і підшару) в плівкових композиціях [Fe50Pt50(15 нм)/проміжний шар
Сu(7,5 нм)/Fe50Pt50(15 нм)]n (де n 1, 2), верхній шар Сu(7,5 нм)/Fe50Pt50
(15 нм) і Fe50Pt50(15 нм)/підшар Сu(7,5 нм) на підложжях SiO2(100
нм)/Si(001) на процеси дифузійного фазоутворення, формування фази L10
та її структурні й магнетні властивості при відпалах у вакуумі. Плівкові
Металлофиз. новейшие технол. / Metallofiz. Noveishie Tekhnol.
2015, т. 37, № 4, сс. 487—498
Оттиски доступны непосредственно от издателя
Фотокопирование разрешено только
в соответствии с лицензией
2015 ИМФ (Институт металлофизики
им. Г. В. Курдюмова НАН Украины)
Напечатано в Украине.
488 Yu. M. MAKOGON, O. P. PAVLOVA, S. I. SIDORENKO et al.
композиції одержано методом магнетронного осадження на термічно оки-
снене (шар SiO2 товщиною 100 нм) підложжя монокристалічного Si(001).
Наступне термічне оброблення тривалістю у 30 секунд виконувалося у ви-
сокому вакуумі 1,310
3
Па в температурному інтервалі 300—900C. Вста-
новлено, що в усіх плівках після осадження формується хемічно невпоря-
дкована фаза A1(FePt). Формування хемічно впорядкованої фази L10(FePt)
у плівках з проміжними шарами міді [Fe50Pt50(15 нм)/проміжний шар
Сu(7,5 нм)/Fe50Pt50(15 нм)]n (де n 1, 2) відбувається в ході відпалу при те-
мпературі 700C і супроводжується різким збільшенням коерцитивної си-
ли, яка зростає також і після наступних високотемпературних відпалів. У
плівках з верхнім шаром міді температура формування фази L10(FePt) пі-
двищується до 900C. У плівці з підшаром міді утворення фази L10(FePt)
рентґенографічно не встановлено, але невелике збільшення коерцитивної
сили після відпалів в інтервалі температур 800—900C може свідчити про
перебіг процесів упорядкування.
Методами физического материаловедения изучено влияние дополнитель-
ного слоя Cu с низкой поверхностной энергией (1,83 Дж/м2) (верхнего,
промежуточного и подслоя) в плёночных композициях [Fe50Pt50(15 нм)/
промежуточный слой Cu(7,5 нм)/Fe50Pt50(15 нм)]n (где n 1, 2), верхний
слой Cu(7,5 нм)/Fe50Pt50(15 нм) и Fe50Pt50(15 нм)/подслой Cu(7,5 нм) на
подложках SiO2(100 нм)/Si(001) на процессы диффузионного фазообразо-
вания, формирование фазы L10 и её структурные и магнитные свойства
при отжигах в вакууме. Плёночные композиции получены методом магне-
тронного осаждения на термически окислённую (слой SiO2 толщиной 100
нм) подложку монокристаллического Si(001). Последующая термическая
обработка длительностью 30 секунд выполнялась в высоком вакууме
1,310
3
Па в температурном интервале 300—900C. Установлено, что во
всех плёнках после осаждения формируется химически неупорядоченная
фаза A1(FePt). Формирование химически упорядоченной фазы L10(FePt) в
плёнках с промежуточными слоями меди [Fe50Pt50(15 нм)/промежуточный
слой Cu(7,5 нм)/Fe50Pt50(15 нм)]n (где n 1, 2) происходит в процессе отжи-
га при температуре 700C и сопровождается резким увеличением коэрци-
тивной силы, которая возрастает также и после последующих высокотем-
пературных отжигов. В плёнках с верхним слоем меди температура фор-
мирования фазы L10(FePt) повышается до 900C. В плёнке с подслоем меди
образование фазы L10(FePt) рентгенографически не установлено, но не-
большое увеличение коэрцитивной силы после отжигов в интервале тем-
ператур 800—900C может свидетельствовать о прохождении процессов
упорядочения.
Key words: chemically ordered phase L10(FePt), thin films, annealing, coer-
cive force.
(Received September 30, 2014; in final version, January 21, 2015)
1. INTRODUCTION
Using of nanosize FePt films with chemically ordered high-coercivity
INFLUENCE OF Cu ON А1 TO L10 PHASE TRANSFORMATION IN Fe50Pt50 FILMS 489
phase L10(FePt) makes it possible to increase the density of magnetic
recording and information storage up to 1 Tb/cm2. High energy of
magnetic-crystalline anisotropy of the L10(FePt) phase Ku 7106
J/m3, which prevents transition to superparamagnetic state with the
decrease of grain volume, promotes it. L10(FePt) phase is formed from
the chemically disordered magnetically soft phase А1(FePt) at temper-
atures higher than 400С. To enhance a technological effectiveness at
usage of these films, the temperature of L10(FePt) phase formation
should be decreased. One of the way to accelerate the ordering process
is the using of the energy of the boundaries, which are additionally
formed in the film composition as a result of introduction of additional
layer of the third element with low surface energy (Ag, Cu, Au) [1—13].
It is supposed that the low surface energy in layered film compositions
can be used as extra driving force, which promotes diffusion rear-
rangement of Fe and Pt atoms and formation of the chemically ordered
L10(FePt) phase with necessary magnetically hard properties.
The purpose of this work is investigation of the impact of the addi-
tional layer of Cu with its different location in the film composition
(upper, intermediate, and sublayer) on the processes of diffusional
phase formation and transition of А1(FePt) phase into L10(FePt) phase,
its structural and magnetic properties in nanosize film compositions
[Fe50Pt50(15 nm)/intermediate layer Cu/Fe50Pt50(15 nm)]n/SiO2(100
nm)/Si (001) (where n 1, 2), Fe50Pt50(15 nm)/underlayer Cu(7.5 nm)/
SiO2(100 nm)/Si(001) and upper layer Cu(7.5 nm)/Fe50Pt50(15 nm)/SiO2
(100 nm)/Si(001) at annealing in vacuum.
2. EXPERIMENTAL TECHNIQUE
Nanosize film compositions (NFC) [Fe50Pt50(15 nm)/intermediate layer
Cu/Fe50Pt50(15 nm)]n/SiO2(100 nm)/Si (001) (where n 1, 2),
Fe50Pt50(15 nm)/underlayer Cu(7.5 nm)/SiO2(100 nm)/Si(001) and up-
per layer Cu(7.5 nm)/Fe50Pt50(15 nm)/SiO2(100 nm)/Si(001) are pro-
duced by the method of layer-by-layer deposition of the layers of
Fe50Pt50 (99.95%) alloy with the thickness of 15 nm and layers of Cu
(99.9%) with the thickness of 7.5 nm on the substrate of the thermally
oxidized layer of SiO2 with the thickness of 100 nm on Si single crystal
of (001) orientation, which is at the room temperature. The annealing
is performed in the high vacuum at the pressure of 1.310
3
Pa within
the temperature range of 300—900С with the holding of 30 sec at each
temperature at the heating rate of 5С/s. The cooling rate is 0.25С/s.
The thickness of the deposited layer is measured using a quartz crystal
resonator and by the method of X-ray reflectometry. The error of the
thickness estimate is 1 nm.
The investigation of NFC after deposition and annealing and deter-
mination of the degree of their chemical ordering is performed by the
490 Yu. M. MAKOGON, O. P. PAVLOVA, S. I. SIDORENKO et al.
X-ray diffraction method using ULTIMA IV Rigaku diffractometer in
CuK-radiation. The degree of chemical ordering of the L10(FePt)
phase is estimated by the ratio of the diffraction reflexes I(001)/I(002)
[14, 15]. The degree of orientation of easy magnetic axis [001] with re-
gard to normal to a surface is determined by the ratio I(001)/I(111).
The change of the chemical composition across the film thickness be-
cause of diffusion processes is investigated by the method of Ruther-
ford back scattering (RBS).
Morphology of film surface is investigated by an atomic force mi-
croscopy (AFM). Magnetic properties of the films are estimated with
the help of the Kerr magnetooptical effect and magnetic force micros-
copy. Resistometric measurements are performed by four-point probe
technique at room temperature.
3. RESULTS AND DISCUSSION
Diffractograms of NFC with different locations of the copper layer af-
Fig. 1. XRD patterns (for CuK-radiation) of [Fe50Pt50(15 nm)/Cu(7,5 nm)/
Fe50Pt50(15 nm) intermediate layer]n (where n 1, 2), Fe50Pt50(15 nm)/Cu(7,5
nm) underlayer and Cu(7,5 nm) top layer/ Fe50Pt50(15 nm) as-deposited films
(а) and after annealing at temperatures of 700С (b), 800С (c), 900С (d).
INFLUENCE OF Cu ON А1 TO L10 PHASE TRANSFORMATION IN Fe50Pt50 FILMS 491
ter deposition and annealing in the temperature range 700—900С are
presented in Fig. 1.
After deposition, structural reflexes (111) from the chemically dis-
ordered phase А1(FePt) are fixed in all films, from copper and from the
substrate (see Fig. 1, a). The value of the coercive force of all films
comprises about 50 oersted that testifies their soft-magnetic proper-
ties, which remain unchanged until the annealing temperature of
600С (see Fig. 2).
According to the results of the X-ray diffraction phase analysis, an-
nealing of the investigated films within the temperature range of 300—
600С are not accompanied by the significant change of their structur-
al and phase composition and magnetic properties. However, as noted
in paper [16], results of investigation of the films with the intermedi-
ate copper layer [Fe50Pt50(15 nm)/intermediate Cu(7.5 nm) lay-
er/Fe50Pt50 (15 nm) by the RBS method show that the thermally acti-
vated diffusion processes between the layers of Cu and FePt take place
at the annealing at the temperature of 300С.
Further annealing in vacuum of the films with the intermediate
copper layer [Fe50Pt50(15 nm)/intermediate Cu(7.5 nm) layer/Fe50Pt50
(15 nm)]n, where n 1, 2, at the temperature of 700С is accompanied
by the transition of the А1(FePt) phase into the chemically ordered
L10(FePt) phase (see Fig. 1, b). The appearance of the superstructural
reflex (001) and splitting of the structural reflex (200) into reflexes
(200) and (002) testifies to that. Low intensity of the (001) reflex testi-
fies to the fact that the specified annealing temperature is not suffi-
Fig. 2. Dependences of coercivity on annealing temperature for [Fe50Pt50(15
nm)/Cu(7,5 nm)/Fe50Pt50(15 nm) intermediate layer]n (where n 1, 2),
Fe50Pt50(15 nm)/Cu(7,5 nm) underlayer, and Cu(7,5 nm) top layer/Fe50Pt50(15
nm) films.
492 Yu. M. MAKOGON, O. P. PAVLOVA, S. I. SIDORENKO et al.
cient for the appearance of the complete ordering in the film. The fact
that the increase of the annealing temperature is accompanied by the
noticeable intensity of (010 and (002) reflexes, serves to show it (see
Fig. 1, c, d). In this case, their magnetic properties enhance, in particu-
lar, the coercive force increases to 8.6 kilooersted (n 1) and 8 kiloo-
ersted (n 2) (see Fig. 2).
In films with the upper layer and sublayer of copper, annealing up to
and including the temperature of 800С does not result in significant
change of structural and phase state. However, in the film with the
upper layer of copper the shift of the structural reflex (111) towards
bigger angles is observed, which is a consequence of appearance of te-
tragonality of the crystal lattice, caused by the start of the phase
transformation А1(FePt) L10(FePt). Appearance of the low intensi-
ty superstructural reflex (001) of the L10(FePt) phase after annealing
at the temperature of 900С, which is by 200С higher than that for the
films with the intermediate copper layer, gives evidence of the lower
intensity of the ordering process (see Fig. 1, c). In the film with the
sublayer of copper, the shift of the structural reflex (111) towards big-
ger angles is observed only after annealing at the temperature of
900С, and the superstructural reflex (001) does not appear at all. The
presence of the copper sublayer largely decelerates the processes of re-
arrangement of iron and platinum atoms and shifts the formation of
the chemically ordered phase to the higher annealing temperatures.
The increase of the coercive force of the film with the upper layer of
copper to 2.3 kilooersted only after the annealing at 700С and of the
film with the sublayer of copper to 1 kilooersted after annealing at
900С also points at the insignificant processes of the ordering in the
films under investigation (see Fig. 2).
Fig. 3. Dependences of І(001)/І(002) (а) and І(001)/І(111) (b) structural re-
flexes intensity ratio of [Fe50Pt50(15 nm)/Cu(7,5 nm)/Fe50Pt50(15 nm) inter-
mediate layer]n (where n 1, 2), Fe50Pt50(15 nm)/Cu(7,5 nm) underlayer, and
Cu(7,5 nm) top layer/Fe50Pt50(15 nm) films.
INFLUENCE OF Cu ON А1 TO L10 PHASE TRANSFORMATION IN Fe50Pt50 FILMS 493
The ratio of intensities of the structural reflexes (001) and (002) for
the films with the intermediate copper layer [Fe50Pt50(15 nm)/inter-
mediate Cu(7.5 nm) layer/Fe50Pt50(15 nm)]n, where n 1, 2 after the
annealing at the temperature of 700С reaches values of 2.8 and 1.3,
respectively. It gives evidence of the establishment of the long-range
order of the L10(FePt) phase (see Fig. 3, a).
It should be noted that the ratio of intensities of the structural re-
flexes (001) and (002) for the film with one intermediate copper layer
insignificantly changes with the annealing temperature growth. One
can suppose that the formation of the chemically ordered phase
L10(FePt) completed during the annealing at the temperature of
700С. In the multilayer film with two intermediate layers of copper
the degree of ordering increases with temperature (see Fig. 3, a). De-
crease of the degree of tetragonality c/a also points at the presence of
the processes of ordering in films with one and two intermediate layers
of copper at the annealing temperature increase to 900С (see Fig. 4,
a). In this case, as follows from Fig. 4, a, more evident decrease of the
degree of tetragonality c/a, as compared with the film of Fe50Pt50 alloy,
points at the fact that introduction of additional layers of copper accel-
erates the processes of ordering. Insignificant increase of the ratio of
intensities of I(002)/I(111) structural reflexes at annealing tempera-
ture increase from 700 to 900С bears evidence of the turn of the c axis
in the direction perpendicular to substrate plane of a small number of
grains (see Fig. 3, b).
The dependences of the crystal lattice parameters a and c of the FePt
phase for the films with one and two intermediate layers of copper are
presented in Fig. 4, b. Data for the film of Fe50Pt50 alloy are presented
for comparison. As one can see from Fig. 4, b, after annealing at the
temperature higher than 700С the lattice parameter c of L10(FePt)
phase for the film with intermediate copper layers is lower than that of
Fig. 4. Dependences of с/а ratio (а) and а and с lattice parameters (b) of FePt
phase on annealing temperature.
494 Yu. M. MAKOGON, O. P. PAVLOVA, S. I. SIDORENKO et al.
the film of the alloy. Decrease of the value of lattice parameter c of the
FePt phase for the film alloyed with copper in comparison with that of
the pure film points at the formation of the thermally stable ternary
alloy Fe(Cu)Pt and the absence of Cu segregating along the grain
boundaries of the L10(FePt) phase [17]. In addition, the shift of the dif-
fraction peak FePt (001) toward the bigger angles is also serves as evi-
dence of the introduction of copper atoms into the face centred tetrag-
onal lattice of the L10(FePt) phase with substitution of Fe or Cu atoms
[18]. The diffraction peak (001) of the L10(FePt) phase after the an-
nealing at 700С for the multilayer films [Fe50Pt50(15 nm)/intermedi-
ate Cu(7.5 nm) layer/Fe50Pt50(15 nm)]n (where n 1, 2) shifts by 0.539
(n 1) and by 0.579 (n 2), respectively. After the annealing at the
temperature of 700С of the multi-layered films [Fe50Pt50(15 nm)/in-
termediate Cu(7.5 nm) layer/ Fe50Pt50(15 nm)]n during formation of
the ternary compound Fe(Cu)Pt the highest copper concentration
(5%) is observed after high temperature annealing in compositions
with sublayer and upper copper layer. The absence of all reflexes of the
L10(FePt) phase can be explained by that the parameter a does not
practically change.
The change with annealing temperature of the electrical resistance
of the films under investigation and its comparison with the film of the
pure Fe50Pt50 alloy is presented in Fig. 5. As one can see, for all films
with the additional copper layer, regardless of its location within the
film composition, the increase of the electrical resistance after anneal-
ing at the temperature higher than 600C is observed. It can be con-
Fig. 5. Dependences of relative electric resistance of [Fe50Pt50(15 nm)/Cu(7,5
nm) intermediate layer/Fe50Pt50(15 nm)]n (where n 1, 2), Fe50Pt50(15 nm)/
Cu(7,5 nm) underlayer, and Cu(7,5 nm) top layer/Fe50Pt50(15 nm) films on
annealing temperature.
INFLUENCE OF Cu ON А1 TO L10 PHASE TRANSFORMATION IN Fe50Pt50 FILMS 495
nected with the diffusion of copper in the grain boundaries and in the
lattice of FePt [12] and formation of the ternary compound Fe(Cu)Pt
[17].
The morphology of the surface of all investigated films changes no-
ticeably with the annealing temperature increase from 300 to 900C.
Photos of the morphology of the surface of the films Fe50Pt50(15
nm)/intermediate Cu(7.5 nm) layer/Fe50Pt50(15 nm) and Fe50Pt50(15
nm)/intermediate Cu(7.5 nm) layer after deposition and annealing in
vacuum are presented in Fig. 6.
As seen from Fig. 6, a and Fig 7, a, the surface of the deposited films
is practically smooth. The annealing temperature increase is accompa-
nied by the growth of surface roughness of the films, in particular,
with the intermediate layer of copper (see Fig. 7, a), in which noticea-
ble growth of grains of the L10(FePt) phase during annealing at the
temperatures higher than 600С is observed (see Fig. 7, b). It is con-
nected with the formation of the L10(FePt) ordered phase and also with
Fig. 6. AFM images of Fe50Pt50(15 nm)/Cu(7,5 nm) intermediate layer/
Fe50Pt50(15 nm) (а—c) and Fe50Pt50(15 nm)/Cu(7,5 nm) underlayer films (d—f)
surface morphology after deposition (а, d) and thermal treatment at tempera-
ture of 700C (b, e) and 900C (c, f).
496 Yu. M. MAKOGON, O. P. PAVLOVA, S. I. SIDORENKO et al.
the absence of copper segregations on the grain boundaries, which in-
hibit the grains growth. In the films with the upper and lower Cu layer,
in which the formation of the ordered phase is not observed, and the
Fe(Cu)Pt ternary compound is formed, the grain size changes insignif-
icantly. One can suppose that copper, which is located on the grain
boundaries, suppresses the grain growth.
Magnetic force microscope (MFM) images of the films with the in-
termediate copper layer [Fe50Pt50(15 nm)/intermediate Cu(7.5 nm) lay-
er/Fe50Pt50(15 nm)]n (where n 1, 2) demonstrate labyrinthine domain
structure after annealing at the temperatures of 700С and 900C (see
Fig. 7. Dependences of surface roughness (а) and grain size on annealing tem-
perature for FePt phase (b) in [Fe50Pt50(15 nm)/Cu(7,5 nm) intermediate lay-
er/Fe50Pt50(15 nm)]n (where n 1, 2), Fe50Pt50(15 nm)/Cu(7,5 nm) underlayer,
and Cu(7,5 nm) top layer/Fe50Pt50(15 nm) films on SiO2/Si(001) substrate.
Fig. 8. MFM images of [Fe50Pt50(15 nm)/Cu(7.5 nm) intermediate layer/
Fe50Pt50(15 nm)]2 film after annealing at temperatures of 700C (а), 900C (b).
INFLUENCE OF Cu ON А1 TO L10 PHASE TRANSFORMATION IN Fe50Pt50 FILMS 497
Fig. 8). MFM images of the multilayer film [Fe50Pt50(15 nm)/interme-
diate Cu(7.5 nm) layer/Fe50Pt50(15 nm)]2 are presented in Fig. 8 as an
example. It bears witness of the magnetically hard properties of the
films under investigation. It is seen that the annealing temperature
growth is accompanied by the growth of domains.
The films with domain structure demonstrate maximal values of the
coercive force after annealing at the temperature of 900C (see Fig. 2).
Consequently, the decrease of the ordering temperature in the films
with one and two intermediate copper layer by 200С (from 900С to
700С) in comparison with the films with the upper layer and sublayer
of copper can be connected with the higher influence of the surface en-
ergy on the Fe50Pt50/Cu interface as the extra driving force of the pro-
cesses of the diffusion phase formation, on one hand. On the other
hand, one can suppose that after the high temperature annealing in the
films with the upper and lower additional copper layer the elevated
copper concentration (50 at.% Cu) as compared with films with in-
termediate copper layers (25 at.% Cu) does not contribute to the de-
crease of the ordering temperature, however, causes the formation of
the FeCuPt ternary compound. This conclusion is in good agreement
with the results of work [17], where it is stated that the copper concen-
tration of 15 at.% is the most efficient for the decrease of the ordering
temperature.
4. CONCLUSIONS
It is established that the introduction of the additional layers of copper
with low surface energy into the film compositions differently influ-
ences over the start temperature of the ordering process.
Formation of two or more interfaces in the film composition
[Fe50Pt50(15 nm)/intermediate Cu(7.5 nm) layer/Fe50Pt50(15 nm)]n,
where n 1, 2, contributes to the reduction of the ordering tempera-
ture by 200С (from 900С to 700С) as compared with the film with
the upper copper layer. Formation of the chemically ordered L10(FePt)
phase is accompanied by the sharp increase of the coercive force of the
films after annealing within the temperature range of 600—900С.
The formation of the L10(FePt) phase in the film with the copper
sublayer is not established radiographically. However, the increase of
the coercive force after annealing within the temperature range of
800—900С can give evidence of the ordering process passing.
This work had a financial support of the German organization on the
academic exchange (DААD) within the framework of the Program
named after L. Euler (grant No. 55576194). The authors enclose their
gratitude to the colleagues from the Chair of Physics of Surface and
Interfaces of the Chemnitz Technical University (Germany), in partic-
ular, Prof. M. Albrecht, Head of Chair, and Dr. G. Beddies for fabrica-
498 Yu. M. MAKOGON, O. P. PAVLOVA, S. I. SIDORENKO et al.
tion of the specimens, help in the pursuance of the research, and dis-
cussion of results.
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/HRV (Za stvaranje Adobe PDF dokumenata najpogodnijih za visokokvalitetni ispis prije tiskanja koristite ove postavke. Stvoreni PDF dokumenti mogu se otvoriti Acrobat i Adobe Reader 5.0 i kasnijim verzijama.)
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/NLD (Gebruik deze instellingen om Adobe PDF-documenten te maken die zijn geoptimaliseerd voor prepress-afdrukken van hoge kwaliteit. De gemaakte PDF-documenten kunnen worden geopend met Acrobat en Adobe Reader 5.0 en hoger.)
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/UKR <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>
/ENU (Use these settings to create Adobe PDF documents best suited for high-quality prepress printing. Created PDF documents can be opened with Acrobat and Adobe Reader 5.0 and later.)
>>
/Namespace [
(Adobe)
(Common)
(1.0)
]
/OtherNamespaces [
<<
/AsReaderSpreads false
/CropImagesToFrames true
/ErrorControl /WarnAndContinue
/FlattenerIgnoreSpreadOverrides false
/IncludeGuidesGrids false
/IncludeNonPrinting false
/IncludeSlug false
/Namespace [
(Adobe)
(InDesign)
(4.0)
]
/OmitPlacedBitmaps false
/OmitPlacedEPS false
/OmitPlacedPDF false
/SimulateOverprint /Legacy
>>
<<
/AddBleedMarks false
/AddColorBars false
/AddCropMarks false
/AddPageInfo false
/AddRegMarks false
/ConvertColors /ConvertToCMYK
/DestinationProfileName ()
/DestinationProfileSelector /DocumentCMYK
/Downsample16BitImages true
/FlattenerPreset <<
/PresetSelector /MediumResolution
>>
/FormElements false
/GenerateStructure false
/IncludeBookmarks false
/IncludeHyperlinks false
/IncludeInteractive false
/IncludeLayers false
/IncludeProfiles false
/MultimediaHandling /UseObjectSettings
/Namespace [
(Adobe)
(CreativeSuite)
(2.0)
]
/PDFXOutputIntentProfileSelector /DocumentCMYK
/PreserveEditing true
/UntaggedCMYKHandling /LeaveUntagged
/UntaggedRGBHandling /UseDocumentProfile
/UseDocumentBleed false
>>
]
>> setdistillerparams
<<
/HWResolution [2400 2400]
/PageSize [612.000 792.000]
>> setpagedevice
|