Chemical-mechanical polishing of sapphire by polishing suspension based on aerosil
The conditions for the optimal balance among the degree of agglomeration of aerosil in the polishing suspension, removal rate, and the quality of the polished sapphire surface under chemical-mechanical polishing (CMP) with the polishing suspension contained surfactants at different pH were determine...
Gespeichert in:
| Datum: | 2015 |
|---|---|
| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | English |
| Veröffentlicht: |
НТК «Інститут монокристалів» НАН України
2015
|
| Schriftenreihe: | Functional Materials |
| Schlagworte: | |
| Online Zugang: | http://dspace.nbuv.gov.ua/handle/123456789/119359 |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Zitieren: | Chemical-mechanical polishing of sapphire by polishing suspension based on aerosil / E.A.Vovk // Functional Materials. — 2015. — Т. 22, № 2. — С. 252-257. — Бібліогр.: 13 назв. — англ. |