Active inductances controlled in GaAs MESFET technology

Two new structures of active inductance which implement MESFET transistors are proposed in this article. The technological parameters of the components of “inductances” are those of 0.8 µm MESFET technology. We expose the advantages of these new structures such as the adjustable character of the val...

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Дата:2006
Автори: Benbouza, M.S., Kenzai-Azizi, C., Merabtine, N., Saidi, Y., Amourache, S.
Формат: Стаття
Мова:English
Опубліковано: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2006
Назва видання:Semiconductor Physics Quantum Electronics & Optoelectronics
Онлайн доступ:http://dspace.nbuv.gov.ua/handle/123456789/121617
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Цитувати:Active inductances controlled in GaAs MESFET technology / M.S. Benbouza, C. Kenzai-Azizi, N. Merabtine, Y. Saidi, S. Amourache // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2006. — Т. 9, № 3. — С. 44-48. — Бібліогр.: 9 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
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spelling irk-123456789-1216172017-06-16T03:04:00Z Active inductances controlled in GaAs MESFET technology Benbouza, M.S. Kenzai-Azizi, C. Merabtine, N. Saidi, Y. Amourache, S. Two new structures of active inductance which implement MESFET transistors are proposed in this article. The technological parameters of the components of “inductances” are those of 0.8 µm MESFET technology. We expose the advantages of these new structures such as the adjustable character of the value of the active inductance like their limitation, and we compare them to those of the literature. 2006 Article Active inductances controlled in GaAs MESFET technology / M.S. Benbouza, C. Kenzai-Azizi, N. Merabtine, Y. Saidi, S. Amourache // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2006. — Т. 9, № 3. — С. 44-48. — Бібліогр.: 9 назв. — англ. 1560-8034 PACS 84.37.+q, 85.30. Tv http://dspace.nbuv.gov.ua/handle/123456789/121617 en Semiconductor Physics Quantum Electronics & Optoelectronics Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
institution Digital Library of Periodicals of National Academy of Sciences of Ukraine
collection DSpace DC
language English
description Two new structures of active inductance which implement MESFET transistors are proposed in this article. The technological parameters of the components of “inductances” are those of 0.8 µm MESFET technology. We expose the advantages of these new structures such as the adjustable character of the value of the active inductance like their limitation, and we compare them to those of the literature.
format Article
author Benbouza, M.S.
Kenzai-Azizi, C.
Merabtine, N.
Saidi, Y.
Amourache, S.
spellingShingle Benbouza, M.S.
Kenzai-Azizi, C.
Merabtine, N.
Saidi, Y.
Amourache, S.
Active inductances controlled in GaAs MESFET technology
Semiconductor Physics Quantum Electronics & Optoelectronics
author_facet Benbouza, M.S.
Kenzai-Azizi, C.
Merabtine, N.
Saidi, Y.
Amourache, S.
author_sort Benbouza, M.S.
title Active inductances controlled in GaAs MESFET technology
title_short Active inductances controlled in GaAs MESFET technology
title_full Active inductances controlled in GaAs MESFET technology
title_fullStr Active inductances controlled in GaAs MESFET technology
title_full_unstemmed Active inductances controlled in GaAs MESFET technology
title_sort active inductances controlled in gaas mesfet technology
publisher Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України
publishDate 2006
url http://dspace.nbuv.gov.ua/handle/123456789/121617
citation_txt Active inductances controlled in GaAs MESFET technology / M.S. Benbouza, C. Kenzai-Azizi, N. Merabtine, Y. Saidi, S. Amourache // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2006. — Т. 9, № 3. — С. 44-48. — Бібліогр.: 9 назв. — англ.
series Semiconductor Physics Quantum Electronics & Optoelectronics
work_keys_str_mv AT benbouzams activeinductancescontrolledingaasmesfettechnology
AT kenzaiazizic activeinductancescontrolledingaasmesfettechnology
AT merabtinen activeinductancescontrolledingaasmesfettechnology
AT saidiy activeinductancescontrolledingaasmesfettechnology
AT amouraches activeinductancescontrolledingaasmesfettechnology
first_indexed 2025-07-08T20:13:51Z
last_indexed 2025-07-08T20:13:51Z
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fulltext Semiconductor Physics, Quantum Electronics & Optoelectronics, 2006. V. 9, N 3. P. 44-48. © 2006, V. Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine 44 PACS 84.37.+q, 85.30. Tv Active inductances controlled in GaAs MESFET technology M.S. Benbouza, C. Kenzai-Azizi, N. Merabtine, Y. Saidi, S. Amourache Physical laboratory of the Thin Layers and Interfaces, University of Constantine, Algeria Electromagnetism and telecommunication laboratory, Electronics department, University of Constantine E-mail: na_merabtine@hotmail.com; Benb5506@yahoo.fr; aziziche@yahoo.fr Abstract. Two new structures of active inductance which implement MESFET transistors are proposed in this article. The technological parameters of the components of “inductances” are those of 0.8 µm MESFET technology. We expose the advantages of these new structures such as the adjustable character of the value of the active inductance like their limitation, and we compare them to those of the literature. Keywords: active inductance, GaAs MESFET, quality factor, silicon bipolar technology, RF applications. Manuscript received 24.02.06; accepted for publication 23.10.06. 1. Introduction The studies of RF inductances are justified by the keen demand of the applications in telecommunication such as filtering in continuous time, the controlled oscillators and decoupling. These basic elements of analog electronics are certainly essential. Integrated passive inductances are limited by their low quality coefficient [1], the reproducibility of their values and the large area of silicon surface necessary for their synthesis for the RF applications, frequency of which is a few gigahertz. It is moreover to note that this problem of size involves an additional difficulty of characterization of the couplings existing between the various tracks that constitute the inductance. Some techniques were introduced to palliate or to lessen the impact of these defects [2, 3]. These improvements were obtained with the detriment of the facility of design and require a high number of used metal layers, as well as lead to the inductance modelling. The wire bonding was also explored in order to synthesize a passive inductance [4]. However, this option does not present a strong integration and poses also the problem of the reproducibility of the inductance value. Thus it remains held for certain applications. For a few years, another approach is known as a renewal of attention on behalf of the analogious originators: the “active inductance”. This revival is mainly due to better performances of the transistors, which result from the technological improvements of the integrated circuit manufacturing processes. In addition to the adjustable aspect of the active inductance, we can note the possibility of obtaining the good quality factors (Q > 5), a broader frequency range, as well as the independence between the inductance value and the circuit size. As we will point out, achievements were presented in GaAs technology for the high frequencies; others were presented in silicon bipolar technology for RF applications in the gigahertz frequency band around. We propose two new GaAs MESFET structures and compare their characteristics to those of other MESFET and bipolar structures from the literature. 2. Active inductances in GaAs technology The first active inductances elaborated in the gigahertz frequency range were in GaAs technology. Fig. 1 represents the basic topology presented by Hara and its characteristics according to the frequency [5]. This configuration implements MESFET transistors. It has an inductance of the order of 13 nH and a series resistance about hundred ohms at 1 GHz frequency. The approximated expressions of the coil and synthesized series resistance are given by: m gs g RC L ext≈ and mg R 1 ≈ , (2.1) where Cgs is the gate-source capacity of the MESFET component, mg is its transconductance, and Rext is the negative feedback resistance connected between the drain of the input transistor and the gate of the second transistor. The transistors are supposed to be identical. The surface area occupies 400×500 µm. Then impro- vements were made to this structure in order to reduce the value of series resistance. Fig. 2 represents an evolution of the circuit of Fig. 1, transistors in feedback Semiconductor Physics, Quantum Electronics & Optoelectronics, 2006. V. 9, N 3. P. 44-48. © 2006, V. Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine 45 00 1100 25 20 15 10 5 0 8 6 4 2 0 L R F/MHz Fig. 1. Basic topology of the active inductance [5]. Common Gate Cascade FET Vc Zin Common Source Cascade FET Fig. 2. The circuit “Cascade FET feedback active inductor”. are called “Cascade FET feedback active inductor” [6]. Using a control voltage Vc, an inductance is adjustable from 2 to 3 nH. This structure has a 8 Ohm series resis- tance and the quality coefficient 5 at 1 GHz frequency. Finally, we present the Zhang configuration [7] that is made up of three transistors of the MESFET type (Fig. 3). In a similar way, via the control voltage provided by the polarization, the value L of the inductance can vary around 7 nH and the series resistance R around 5 Ohm at 1 GHz frequency. The values of L and R are given by: ⎟ ⎟ ⎠ ⎞ ⎜ ⎜ ⎝ ⎛ ⎟⎟ ⎠ ⎞ ⎜⎜ ⎝ ⎛ +≈ 2 3 2 12 Tmm gs f f gg C L and 1 3 / 11 − ⎟ ⎟ ⎠ ⎞ ⎜ ⎜ ⎝ ⎛ ⎟⎟ ⎠ ⎞ ⎜⎜ ⎝ ⎛ −≈ T m ff gR (2.2) where Tf is the transition frequency of the transistors, gm is the transconductance of the transistor 1 or 2 and gm3 is the transconductance of the transistor 3. The maximum used frequency reaches approximately 8 GHz. 3. Active inductances in silicon bipolar technology 3.1. Generalities The surface occupied by the integrated circuits in bipolar technology is important because of many passive elements (inductance, capacity and resistance) and active of polarization. The various studies undertaken on the active induc- tances conceived starting from transistors of the bipolar type showed that their quality coefficient is proportional to the transistor parameters according to the formula: outg g Q m= , (3.1) where outg is the output conductance of the transistor and mg is its transconductance. Thus the bipolar transistor presents interesting possibilities for the synthesis of active inductances taking into account its strong transconductance compared to that of MESFETs. Moreover, in the frequency range near gigahertz, the inductance values used are more important than those met at the higher frequencies. Then the output transconductance of the bipolar transistor contributes to the necessary increase in the inductance value. Moreover, other advantages result from it: • The advantage over the transconductance will lead to a less power consumption. • The size of the bipolar transistors being lower, the saving in space compared to the GaAs configurations is interesting. Q1 Q2 Q3 Fig. 3. Circuit of the active inductance presented by Zhang [7]. L , n H R in , Ω 800 600 400 200 Semiconductor Physics, Quantum Electronics & Optoelectronics, 2006. V. 9, N 3. P. 44-48. © 2006, V. Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine 46 Fig. 4. Electric diagram of the active inductance [8]. 5.00 3.75 2.50 1.25 0.00 100 200 1000 Freq(MHz) LOG Lin Rin Fig. 5. AC Simulation of the active inductance and the asso- ciated series resistance. • Silicon BiCMOS technology used to carry out active inductance opens the possibility of integration of analog and digital functions. Their various circuits that we will consider in bipolar technology are those of an inductance connected to the ground. 3.2. R. Kaunisto model In the circuit presented by R. Kaunisto [8], used was a configuration with two n-p-n transistors given in Fig. 4. Using the HF2CMOS technology parameters, during the AC simulations of this structure revealed was an average inductance of about 3.5 nH and a resistance of approximately 1 Ohm with a notable reduction in the value of the series resistance from 850 MHz (Fig. 5). Then the best quality factor is obtained at the frequency for which the series resistance is minimal, Q is equal 20 at a 1 GHz frequency. 4. Proposed models In this part of the study, we propose two MESFET based models to determine active inductances. 4.1. The first suggested inductance The first structure that we propose comprises two n-type MESFET transistors, transition frequency of which is of the order of 9 GHz under the used polarization conditions. Its small signal equivalent electric diagram is shown in Fig. 6. The AC simulations (Figs 7-9) of this configuration results in 1 GHz with an adjustable inductance of about 7 nH and a resistance series of about 2 Ohm. The obtained inductance is proportional to the MESFET parameters. This dependence clarifies the adjustable character of the inductance by the means of the polarization current. Indeed, the intrinsic parameters of the model such as Cgs, Cds, Cdg, and gm depend on the transistors polarization current [9]. Compared to the performances of the circuit in Fig. 6, this structure must be modified in order to reduce the ohmic loss and increase the quality factor. 4.2. The second suggested inductance The second suggested structure is shown in Fig. 10 to reduce the series resistance. This circuit adopts a configuration with three n-type MESFET transistors (fT ~ 9 GHz). The simulations (Figs 11-13) show that this circuit satisfies our criteria: the value of the variable inductance obtained is about 12.5 nH and the series resistance remains lower than 1.3 Ohm at 1 GHz frequency. Fig. 6. Electric diagram of the first suggested active inductance. Fig. 7. AC simulation of the series resistance associated with the inductance. 10.6 1.50 2.50 0.00 R in , Ω L in , ( nn H ) Semiconductor Physics, Quantum Electronics & Optoelectronics, 2006. V. 9, N 3. P. 44-48. © 2006, V. Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine 47 Fig. 8. Frequency variation of the inductance. Quality factor Fig. 9. Frequency variation of the value of the inductance quality coefficient. 4.3. Conclusion and comparison between these two configurations It should be noted for the configurations of Figs 6 and 10 that the polarization conditions were determined to obtain a good quality factor. These polarization conditions can also be sources of instabilities, which result from the influence of polarization on the series resistance of the inductance; however, the series resistance can indeed become negative under certain conditions. Table. Comparison of the various presented configurations. Parameter Circuit Fig. 2 Fig. 3 Fig. 4 Fig. 6 Fig. 10 L (nH) 2 6 3.5 7 12.5 R (Ohm) 8 5 1 2 1.3 Q 5 − 20 5 8 Consumption (mW) − − − 10 20 Table illustrates well the evolution of the inductance L and the resistance R among the topologies of Figs 2, 3, 4, 6, and 10 from a value and power consumption point of view. The circuit of Fig. 10 is that shows the best charac- teristics. Moreover, it proposes a value of the inductance higher than the circuit of the Fig. 6 configuration for a less power consumption. This inductance value and that of the associated series resistance are adapted to the RF applications of the filtering type and oscillators at 1 GHz frequency. Fig. 10. Electric diagram of the second suggested active inductance. Fig. 11. AC simulation of the circuit inductance. Fig. 12. AC simulation of the series resistance associated with the inductance. Semiconductor Physics, Quantum Electronics & Optoelectronics, 2006. V. 9, N 3. P. 44-48. © 2006, V. Lashkaryov Institute of Semiconductor Physics, National Academy of Sciences of Ukraine 48 Quality factor Fig. 13. Frequency variation of the quality coefficient value. References 1. J.N. Burghartz, D.C. Edelstein, Mr. Soyuer, H.A. Ainspan, and K.A. Jenkins, RF circuit design aspects of spiral inductors one silicon // IEEE New- spaper of Solid-State Circuits 33, No 12 (Dec. 1998). 2. C.P. Yue and S.S. Wong, Spiral one-chip inductors with patterned ground shields for if-based RF IC' S // Ibid. 33, No 5 (May 1998). 3. J.N. Burghartz, Mr. Soyuer, H.A. Ainspan, and K.A. Jenkins // Integrated RF and microwave com- ponents in BiCMOS technology // IEEE Trans- actions One-Electron Devices 43, No 9 (Sept. 1996). 4. F. Svelto, S. Deantoni, and C. Castello, A 1.3 GHz low-phase noise fully tunable CMOS LLC VCO // IEEE Newspaper of Solid-State Circuits 35, No 3 (Mar. 2000). 5. S. Hara, T. Tokumitsu, Mr. Aikawa, Lossless broad- band monolithic microwave activate inductors // IEEE Transactions on Microwave Theory and Techniques 37, No 12, p. 1979-1984 (Dec. 1989). 6. S. Hara, T. Tokumitsu, T. Tanaka, Mr. Aikawa, Broad-band monolithic microwave activates inductor and its application to miniaturized wide-band amp- lifiers // Ibid. 36, No 12, p. 1920-1924 (Dec. 1988). 7. G.F. Zhang, Mr.L. Villegas, C.S. Ripoll, and J.L. Gautier, New broadband tunable monolithic microwave floating activate inductor // Electronics Lett. 28, No 1 (Jan. 1992). 8. R. Kaunisto, P. Alinikula, and K. Stadius, Activate inductors for GaAs and bipolar technologies // AICSP 7 (1995). 9. B. Tiallet-Guy, Z. Ouarche, M. Prigent, R. Quere, and J. Obregon, Direct extraction of a distributed nonlinear fet model from pulsed // IEEE Microwave and Guided Wave Letters 8, No 2 (Feb. 1998).