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Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials

by Kravetsky, M.Yu., Sypko, S.A., Fomin, A.V.
Published 2002

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Balance model for contactless chemo-mechanical polishing of wafers

by Grigoriev, N.N., Kravetsky, M.Yu., Paschenko, G.A., Sypko, S.A., Fomin, A.V.
Published 2002

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Balance model for contactless chemo-mechanical polishing of wafers

by Grigoriev, N.N., Kravetsky, M.Yu., Paschenko, G.A., Sypko, S.A., Fomin, A.V.
Published 2002

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