Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing

von Pashchenko, G.A., Kravetskyi, M.Yu., Fomin, A.V.
Veröffentlicht 2015

Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials

von Kravetsky, M.Yu., Sypko, S.A., Fomin, A.V.
Veröffentlicht 2002

Balance model for contactless chemo-mechanical polishing of wafers

von Grigoriev, N.N., Kravetsky, M.Yu., Paschenko, G.A., Sypko, S.A., Fomin, A.V.
Veröffentlicht 2002