Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing

by G. A. Pashchenko, Yu. Kravetskyi, A. V. Fomin
Published 2015

Model of smoothing roughness on GaAs wafer surface by using nonabrasive chemical-and-mechanical polishing

by A. V. Fomin, G. A. Pashchenko, Yu. Kravetskyi, I. G. Lutsyshyn
Published 2017