Properties of junction diodes under conditions of bisotropic strains

In consideration of influence of technological strains on characteristics of junction diodes located on surface of silicon wafers, biaxial character of such strains has taken into account. The cases of (001)- and (111)-oriented silicon wafers on whose surface the diodes are located as well as lon...

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Збережено в:
Бібліографічні деталі
Дата:2009
Автор: Borblik, V.L.
Формат: Стаття
Мова:English
Опубліковано: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2009
Назва видання:Semiconductor Physics Quantum Electronics & Optoelectronics
Онлайн доступ:http://dspace.nbuv.gov.ua/handle/123456789/118608
Теги: Додати тег
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Цитувати:Properties of junction diodes under conditions of bisotropic strains / V.L. Borblik // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2009. — Т. 12, № 1. — С. 42-46. — Бібліогр.: 20 назв. — англ.

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Digital Library of Periodicals of National Academy of Sciences of Ukraine
Опис
Резюме:In consideration of influence of technological strains on characteristics of junction diodes located on surface of silicon wafers, biaxial character of such strains has taken into account. The cases of (001)- and (111)-oriented silicon wafers on whose surface the diodes are located as well as longitudinal (in plane of the wafer) and transversal (perpendicular to it) diode current flow have been considered. It is shown that at small strains, the diodes located on the surface of (111)-Si are less subjected (as a whole) to their influence. Furthermore, the change in the intrinsic carrier concentration has been assessed in (001)-Si at very large bisotropic strains. The concentration is shown to increase by several orders of magnitude irrespective of the strain sign.