Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials

On the basis of the balance model for convection-diffusion processes that occur during string chemical cutting (CC) of samples, we derive an analytical expression for the limiting CC rate at maximal use of etching agent. Comparison between the experimental and theoretical dependencies of CC rates fo...

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Datum:2002
Hauptverfasser: Kravetsky, M.Yu., Sypko, S.A., Fomin, A.V.
Format: Artikel
Sprache:English
Veröffentlicht: Інститут фізики напівпровідників імені В.Є. Лашкарьова НАН України 2002
Schriftenreihe:Semiconductor Physics Quantum Electronics & Optoelectronics
Online Zugang:http://dspace.nbuv.gov.ua/handle/123456789/121332
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Назва журналу:Digital Library of Periodicals of National Academy of Sciences of Ukraine
Zitieren:Investigation of the effect of technological parameters on efficiency of chemical string cutting of semiconductor materials / M.Yu. Kravetsky, S.A. Sypko, A.V. Fomin // Semiconductor Physics Quantum Electronics & Optoelectronics. — 2002. — Т. 5, № 3. — С. 328-331. — Бібліогр.: 3 назв. — англ.

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