Fabrication and wear performance of (Cu–Sn) solution/TiCx bonded diamond composites
The Cu(Sn)–TiCx bonded diamond composites were prepared by in situ reaction sintering of Cu, Ti₂SnC and diamond powders. Effect of Ti₂SnC content on the phase composition, microstructure and grinding properties were studied.
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| Datum: | 2018 |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | Russian |
| Veröffentlicht: |
Інститут надтвердих матеріалів ім. В.М. Бакуля НАН України
2018
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| Schriftenreihe: | Сверхтвердые материалы |
| Schlagworte: | |
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| Назва журналу: | Digital Library of Periodicals of National Academy of Sciences of Ukraine |
| Zitieren: | Fabrication and wear performance of (Cu–Sn) solution/TiCx bonded diamond composites / L. Baoyan, H. Danhui, Z. Wangxi // Сверхтвердые материалы. — 2018. — № 3. — С. 33-39. — Бібліогр.: 13 назв. — англ. |