Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits

Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits

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Bibliographische Detailangaben
Datum:	2014
Hauptverfasser:	V. L. Lanin, I. B. Petukhov
Format:	Artikel
Sprache:	English
Veröffentlicht:	2014
Schriftenreihe:	Technology and design in electronic equipment
Online Zugang:	http://jnas.nbuv.gov.ua/article/UJRN-0000405258
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!
Назва журналу:	Library portal of National Academy of Sciences of Ukraine \| LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS

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